AMD Ryzen 5000 Desktop APUs, Radeon RX 6000M Mobile GPUs, FidelityFX Upscaling Tech Announced at Computex 2021

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AMD has made various major product announcements at the virtual Computex 2021 business show. All over her keynote, CEO Dr. Lisa Su unveiled new desktop Ryzen 5000 series APUs with integrated graphics, new discrete Radeon RX 6000M series mobile GPUs promising top-tier gaming performance, the AMD Virtue label for laptops promising optimised design and performance, and also the highly anticipated Constancy FX Super Resolution graphics upscaling technology which is broadly compatible with GPUs from all manufacturers.

Starting with the new desktop APUs, the Ryzen 7 5700G and Ryzen 5 5600G will fill gaps out there between existing Ryzen 5000 series CPUs, and must also help alleviate problems caused by the current scarcity of discrete graphics cards which has led to huge price spikes. Codenamed ‘Cezanne’, the two new processor models will be to be had worldwide starting August 5.

The Ryzen 7 5700G is priced at $359 (about Rs. 26,815 before taxes) and has 8 CPU cores with multi-threading, running at up to 4.6GHz in addition to 8 GPU compute units. The Ryzen 5 5600G however is priced at $259 (about Rs. 19,345) and has six cores with multithreading plus 7 GPU CUs. Both have 65W TDP ratings and will be sold with bundled coolers. They’re going to work with all motherboards that beef up current Ryzen 5000 series CPUs. AMD promises that the integrated GPUs in its new desktop processors will be capable to 1080p gaming in addition to handling satisfied creation workloads.

AMD also announced six Cezanne-based Ryzen Pro CPUs for businesses; three with 65W TDPs and three with 35W TDPs intended for small-form-factor desktops, citing strong demand for compact commercial desktops with security and manageability features.

The new Radeon RX 6000M mobile GPU series is based on the RDNA2 architecture which supports DirectX ray tracing and Smart Access Reminiscence (AMD’s implementation of resizable BAR). They also promise substantial 1.5X performance improvements or up to 43 percent better power efficiency than the preceding generation. The flagship Radeon RX 6800M is said to deliver over 120fps in today’s popular games while running at 1440p at high settings, including Battlefield V, F1 2020, Overwatch, and Apex Legends. Going down the stack, the new Radeon RX 6700M and Radeon RX 6600M which promise over 100fps at 1440p and 1080p respectively.

The Radeon RX 6800M features 40 compute units and ray accelerators. It is going to have 12GB of GDDR6 RAM on a 192-bit interface plus a 96MB “Infinity cache”. According to AMD, it is going to be competitive with Nvidia’s GeForce RTX 3080 and RTX 3070 in laptops. The Radeon RX 6700M has 36 CUs and ray accelerators, with 10GB of GDDR6 on a 160-bit bus and 80MB cache reminiscence. The Radeon RX 6600M goes down to 28 CUs and ray accelerators, with 8GB of GDDR6 on a 128-bit bus and a 32MB cache.

More than one design goals have been defined for AMD Virtue laptops

 

The nominal TDP ratings for the three GPUs are 145W, 135W and 100W respectively, but these will also be tweaked by laptop OEMs depending on their chassis and cooling designs. Moreover, the new Radeon RX 6000M series GPUs all beef up AMD’s SmartShift power balancing tech when used with a Ryzen mobile CPU. AMD also says buyers can expect improved performance from power-constrained thin-and-light laptops, in addition to when running on battery power. Laptops featuring these new GPUs will be announced by OEMs starting in June 2021.

To elevate gaming laptops based on Ryzen CPUs and Radeon GPUs in addition to their supporting software, AMD has introduced a new AMD Virtue Design Framework. The new initiative will see the company working closely with laptop OEMs to help optimise performance in addition to fine-tune parameters such as operating temperatures, display quality, acoustics, connectivity, battery power, size, and weight. The first laptops developed under this initiative will be launched in June 2021, starting with a new Asus ROG Strix G15 and HP Omen 16.

FidelityFX Super Resolution will offer four levels of performance vs image quality

 

AMD also shared details of its upcoming FidelityFX Super Resolution upscaling framework, which will be rolling out later this year. It is set to take on Nvidia’s DLSS (Deep Learning Supersampling) technology, which allows GeForce GPUs to compensate for the performance hit imposed by ray tracing by rendering at lower resolutions and then upscaling to a target resolution. AMD has stated that FidelityFX will be supported not only by quite a lot of Radeon GPUs and Ryzen APUs, but also the competition, most notably Nvidia’s GeForce series.

This broad compatibility, and the truth that it is open source, will tempt developers to beef up FidelityFX, according to AMD. Gamers will have four image quality options, so gamers will be in a position to select their preferred balance of frame rate and quality. Performance is said to be up to 2.5X better than local resolution rendering in some titles. More details approximately FidelityFX Super Resolution, including a list of supported games, will be announced on June 22.

Closing out the keynote, Su previewed AMD’s upcoming 3D chiplet manufacturing capabilities in the form of a prototype CPU based on the existing Ryzen 9 5900X CPU, but with an extra 3D vertical cache. A new 64MB 7nm SRAM chiplet layer is stacked directly on top of every core complex, tripling its L3 cache capacity in the same footprint with nearly no visible difference. The cache is bonded directly to the underlying layer the use of copper-to-copper bonds with no solder, resulting in greater density and efficiency than other similar approaches to silicon stacking in the industry, according to AMD.

In a gaming demo, the 3D chiplet prototype achieved a 15 percent higher frame than a standard Ryzen 9 5900X CPU running at the same speed, which Su characterised as an entire architectural generation’s worth of performance uplift. The 3D V-Cache is only the first implementation of 3D chiplets, and Su also announced that high-end products designed with 3D chiplets will go into production by the end of 2021.

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